PITTSBURGH, PA, June 7, 2017 – ANSYS is expanding its best-in-class engineering simulation architecture to combine the advanced computer science of elastic computing, big data and machine learning to the physics-based world of engineering simulation. Available today, ANSYS RedHawk-SC, ANSYS Path-FX and ANSYS CMA enable automotive, mobile and high-performance computing (HPC) organizations to accelerate electronic product innovation and improve performance, reliability and cost.

Today’s leading automotive, HPC and mobile electronics require semiconductor chips with advanced process nodes to improve processor power consumption. As the scale and complexity of these chips increase, emerging design technologies need to provide optimized tools to quickly and accurately analyze and manage data. RedHawk-SC, Path-FX and CMA empower organizations to meet the growing electronic system demands for advanced driver-assistance systems, mobile phones, GPU-powered artificial intelligence and…

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